Mechanical devices design
Stress, strain, deformation and displacement distribution and failure analysis of mechanical devices, plus temperature distribution and local overheating assessment.
Available Analysis Modules
QuickField can be applied to many aspects of mechanical device design:
Stress Analysis
Stress, strain, deformation and displacement distribution; failure analysis.
Heat Transfer
Temperature distribution, assessing local overheating, and can serve as a load source for thermal stress analysis.
Companion Tools
- StressDeform — updates a body's shape in the geometry model based on stress analysis results
Related Simulation Examples3
All examples →
Stress distribution in a long solenoid
Axisymmetric multiphysics: DC Magnetics coupled with stress analysis
Pipe subject to temperature and pressure
Axisymmetric multiphysics: heat transfer coupled with stress analysis
TOKAMAK solenoid mechanical stress
Axisymmetric multiphysics: DC Magnetics coupled with stress analysisOther Application Areas
Actuator designBuilding insulationCable designCapacitor designElectrical machines designElectron-ion optic deviceEMC analysisHigh voltage system designInduction heating system designInsulator designMagnetic systems designPCB designSensors designSpeaker designSuperconducting system designThermal models designTransformer designTransmission line design