QuickField

Building insulation

Heat transfer analysis of building components, including window and door frames, thermal bridges, underfloor heating systems, condensation risk assessment and insulation optimization.

Available Analysis Modules

Building insulation design often relies on numerical simulation to develop efficient solutions and demonstrate that thermal performance meets building codes. QuickField's steady-state and transient heat transfer modules can be used effectively for thermal analysis of building components, including window and door frames and thermal bridges; they can also analyze underfloor heating systems, assess condensation risk, and optimize insulation design. Available analysis options:

Heat Transfer

Thermal bridges, window and door frames, underfloor heating, condensation risk.

Stress Analysis (coupled with thermal analysis)

Thermal stress in building components.

Companion Tools

Related Simulation Examples1

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